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王正直

姓名
Name
王正直
Zhengzhi Wang
性别
出生年月
1986.11
学历学位
Academic Degree
工学博士
Ph.D.
职称
Title
副研究员
Associate Professor
博导/硕导
 
邮编
Zip Code
430072
电话
 
手机
Mobile
(86)18162323219
通信地址
Address
武汉武昌东湖南路8号
8 Eastlake South Rd,Wuhan
Email
学习经历 (Academic Training)
Ÿ   2012.09-2015.05美国国家标准与技术研究院(NIST)生物材料组,博士后
Biomaterials and Biosystems Division, National Institute of Standards and Technology (NIST), Gaithersburg, MD, USA, Postdoctoral Associate
 
Ÿ   2007.09-2012.07中国科学技术大学近代力学系,工学博士
Dept. Modern Mechanics, University of Science and Technology of China, Hefei, Anhui, China, PhD in Solid Mechanics
 
Ÿ   2004.03-2007.07安徽大学物理与材料科学学院,理学学士
School of Physics and Materials Science, Anhui University, Hefei, Anhui, China, Bachelor in Physics
任职经历 (Working Experience)
Ÿ   2015.06至今,武汉大学土木建筑工程学院,副研究员
2015. 06 to present, School of Civil Engineering, Wuhan University, Wuhan, Hubei, China, Associate Professor
含本科生和研究生课程
暂无
 
 
 
 
 
 
 
 
主要研究领域 (Research Interests)
Ÿ   实验微纳米力学和摩擦学 (experimental micro/nano mechanicsand tribology)
Ÿ   聚合物及其复合材料的性能表征和应用 (characterization and development of polymers and polymer based composites for various applications)
Ÿ   生物仿生和生物力学 (biomimetics and biomechanics)
Ÿ   光聚合和牙齿修复材料 (photopolymerization and dental restorative materials)
 
主要论文著作 (Peer-reviewed Publications)
Ÿ   Zhengzhi Wang,and Martin Y.M. Chiang, “Correlation between polymerizationshrinkage stress and C-factor depends upon cavity compliance”, Dental Materials, in press (2015)
Ÿ   Zhengzhi Wang, Forrest A. Landis, Anthony A.M. Giuseppetti, Sheng Lin-Gibson, and Martin Y.M. Chiang, “Simultaneous measurement of polymerization stress and curing kinetics for photo-polymerized composites with high filler contents”,Dental Materials, 30, 1316-1324(2014)
Ÿ   Zhengzhi Wang, Ping Gu, and Xiaoping Wu, “Gecko-inspired bidirectional double-sided adhesives”,Soft Matter, 10, 3301-3310 (2014)
Ÿ   Zhengzhi Wang, Ping Gu, Hui Zhang, Zhong Zhang, and Xiaoping Wu, “Indenter geometrical effects on sub-micro/nano indentation and scratch behaviors of polymeric surfaces”,Mechanics of Advanced Materials and Structure,23, 291-300(2016)
Ÿ   Zhengzhi Wang, Ping Gu, Xiaoping Wu, Hui Zhang, Zhong Zhang, and Martin Y.M. Chiang, “Micro/nano-wear studies on epoxy-silica nanocomposites”,Composites Science and Technology, 79, 49-57 (2013)
Ÿ   Zhengzhi Wang, Ping Gu, and Xiaoping Wu, “A gecko-inspired double-sided adhesive”,Physical Chemistry Chemical Physics, 15, 20764-20770 (2013)
Ÿ   Zhengzhi Wang,Ping Gu, Hui Zhang, Zhong Zhang, and Xiaoping Wu, “Finite element modeling of the indentation and scratch response of epoxy/silica nanocomposites”,Mechanics of Advanced Materials and Structure, 21, 802-809 (2013)
Ÿ   Zhengzhi Wang, Yun Xu, and Ping Gu, “Adhesive behaviour of gecko-inspired nanofibrillar arrays: combination of experiments and finite element modelling”,Journal of Physics D: Applied Physics,45, 142001 (2012) (Selected inHighlights collection)
Ÿ   Zhengzhi Wang, Ping Gu, Zhong Zhang, Lei Gu, and Youzhong Xu, “Mechanical and tribological behavior of epoxy/silica nanocomposites at the micro/nano scale”,Tribology Letters, 42, 185-191 (2011)
Ÿ   Zhengzhi Wang, Ping Gu, and Zhong Zhang, “Indentation and scratch behavior of nano-SiO2/polycarbonate composite coating at the micro/nano-scale”, Wear, 269, 21-25 (2010)
Ÿ   王正直,辜萍,杨翀,缪泓,张忠,基于MATLAB图像处理技术计算微纳米级磨损量,实验力学200924(5)
Ÿ   王正直,辜萍,纳米复合材料摩擦磨损性能研究进展,润滑与密封200934(5)
 
技术报告 (Technical Publication)
Ÿ   Zhengzhi Wang, Paula J. Baker, and Martin Y.M. Chiang, “Guide to NIST Instrument for the Measurement of Polymerization Shrinkage Stress, Curing Kinetics and Temperature for Photopolymerized Materials”, NIST technical publication (2014)
 
承担的主要科研项目
暂无
 
NISTDistinguished Associate Accolades 2015
主要社会和
学术兼职
担任以下学术期刊的审稿人(Reviewer for the following scientific journals)
Lab on a Chip; Journal of Materials Chemistry B;Nanotechnology;Composites Science and Technology; PLOS ONE;Smart Materials and Structures;Materials Chemistry and Physics; Industrial & Engineering Chemistry Research; RSC Advances;Journal of Physics D: Applied Physics; Measurement Science and Technology